Bill of materials
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Part Value Device Package Description
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C2 100nF C0805 RC0805 Kondensator 0805
C3 100nF C0805 RC0805 Kondensator 0805
C10 10uF C1206 RC1206 Kondensator 1206
C11 10uF C1206 RC1206 Kondensator 1206
C20 33pF C0805 RC0805 Kondensator 0805
C21 not equipped C0805 RC0805 Kondensator 0805
IC1 Mainboard ST-DMATHT2 DIL40-SPEZ ST-DMA im 40-poligen Gehäuse
IC2 74HC05 74X05SMD SO14 Open Collector, invertierend 6mal
IC3 74HC74 74X74SMD SO14 D-Flip-Flop mit pos. Eingang 2mal
IC4 74HC10 74X10SMD SO14 NAND mit 3 Eingängen 3mal
R1 1K R0805 RC0805 Widerstand 0805
R2 0R R0805 RC0805 Widerstand 0805
F-types can also be used instead of HC-Gates (IC2,IC3 and IC4).
The circuit was tested with HC-types.
Please note!
All components are assembled on the bottom side of the board.
Tip: Equip IC2, IC3 and IC4 first, then the capacitors and the resistor.
Finally, the individual solder cups (Lötkelche) follow, which are pressed
into the PCB from above and soldered from below. The solder cups can be
snapped out of an IC socket.
Ci, którzy przemawiają w imieniu Boga powinni pokazać listy uwierzytelniające. J. Tuwim